Technical Specifications
|
Description |
Parameter |
|
Resolution |
0.1 - 10 μm |
|
Interface |
BISS-C , SSI , MODEBUS-RTU , Tamagawa etc |
|
Repeatability |
≤±1μm @1μm resolution , 0.3mm gap |
|
Positioning Accuracy |
≤30μm, depends on the module |
|
Position update time |
< 5μs, during communication |
|
Max Measuring Length |
16.4M |
|
Maximum Speed |
10 m/s |
|
Sensing Distance |
≤ 0.8 mm , optimal 0.3±0.1 mm |
|
Working Voltage |
5V±5% |
|
Absolute Position Startup Time |
< 400 ms |
|
Operating current |
<120mA , 25℃ room temperature |
|
Output Signal |
Differential signal (RS422) / Serial protocol (RS485) |
|
Load current |
±60 mA |
|
ESD protection |
RS422 , HBM, max. ±20kV; RS485 , HBM, max. ±15kV |
|
Cable Length |
Default: 0.3M, max: 10M |
|
Interface Frequency |
BISS-C , RS422 , Max clock = 10Mhz SSI , RS422 , Max clock = 0.7Mhz MODEBUS-RTU , RS485 , max Baud Rate: 256K Tamagawa , RS485 , Baud Rate 2.5M , 24bit |
|
Housing Material |
Aluminum |
|
Connector type |
DB9 / DB15 / SCSI-26 / SM-6P , customizable, no connector |
|
Overall Dimensions |
46*14*10.5MM |
|
Mounting Hole Spacing |
40 mm |
|
Operating Temperature |
-20 ... 80℃ |
|
Protection Rating |
IP67 |
|
Max allowed External Magnetic Field |
0.5 mT |
